Join Us in Hangzhou, China!
2026 International Workshop
on Advanced Interconnects
November 4 – 6. 2026
Hangzhou, China
Special Sessions
Special Session 1
Advanced Computational Modeling and Simulation for Multiphysics and Multiscale Systems
Session Chairs
Naixing Feng, Anhui University
Wei Gu, Beijing Institute of Technology
Special Session 2
Advanced Multiphysics Analysis Algorithms and Coupled-Physics Mechanisms in Integrated Circuits
Session Chairs
Yue Zhang, East China University of Science and Technology
Tiancheng Zhang, Nanjing University of Science and Technology
Special Session 3
Novel Microwave Equipment for Different Application Scenarios
Session Chairs
Yuxian Zhang, Anhui University
Wei Wang, Hangzhou Dianzi University
Special Session 4
Intelligent Multiphysics Simulation Algorithms and Applications: Data-driven, Physics-driven, and Hybrid-driven Paradigms
Session Chairs
Huan Huan Zhang, Xidian University
Hua Guang Bao, Nanjing University of Science and Technology
Meng Meng Li, Nanjing University of Science and Technology
Special Session 5
Advanced Electromagnetic Measurement, Field Modeling and Wireless Channel Emulation for Next-Generation Interconnect and RF Systems
Session Chairs
Zhao Yuan, Chengdu University of Information Technology
Special Session 6
Signal and Power Integrity with Mobile AI device Applications
Session Chairs
Shufang Li, Beijing University of Posts and Telecommunications
Xiaohe Chen, China University of Petroleum (Beijing)
Special Session 7
State-of-the-Art Technologies of EMI Filters for Power Supplies or PDN
Session Chairs
Yusheng Hu, Jimei University
Jiazheng Xu, ZTE Corporation
Special Session 8
Interconnect Reliability & Materials
Session Chairs
Haohui LONG, Shanghai Jiao Tong University
Yunwen Wu, Shanghai Jiao Tong University
Special Session 9
Intelligent Parametric Modeling and Inverse Design Approaches for Metasurfaces
Session Chairs
Jia Nan Zhang, Southeast University
Special Session 10
Integrated Circuit Measurement, Testing and Metrology
Session Chairs
Ge Shi, China Jiliang University
Yan Li, China Jiliang University
Zhipeng Xu, China Jiliang University
Special Session 11
Near-Field Modeling and Design
Session Chairs
Da Yi, Chongqing University
Pei Xiao, Hunan University
Xing-Chang Wei, Zhejiang University
Special Session 12
Advanced EM Modeling and Optimization Methodologies for 2.5D/3D Packages and High-Speed Interconnects
Session Chairs
Ping Li, University of Electronic Science and Technology of China
Xiaochun Li, Shanghai Jiao Tong University
Min Tang, Shanghai Jiao Tong University
Special Session 13
AI-Enabled Electromagnetic Interference Modeling and Prediction
Session Chairs
Dan Shi, Beijing University of Posts and Telecommunications
Yinliang Diao, South China Agricultural University
Special Session 14
Advanced Printed Circuit Technologies at Millimeter-wave and Terahertz Technologies
Session Chairs
Yifei Zhang, Shandong University
Weihong Liu, Xi'an University of Posts&Telecommunications
Special Session 15
Smart Electromagnetic Control and Meta-Device Design
Session Chairs
Tong Cai, Air and Missile Defense College, Air Force Engineering University
Special Session 16
AI-Assisted TCAD and EDA Technology for Heterogeneous IC Design
Session Chairs
Da-Wei Wang, Hangzhou Dianzi University
Shuo Zhang, Zhejiang University
Special Session 17
Advanced Algorithms and Multiphysics Analysis for 3D Integrated Systems
Session Chairs
Qiwei Zhan, Zhejiang University
Haoqiang Feng, Zhejiang University