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HOME CALL FOR PAPERS SPECIAL SESSIONS SUBMISSION REGISTRATION CALL FOR EXHIBITION TRAVEL/VENUE ABOUT HangZhou CONCURRENT COURSES PAST CONFERENCES
HOME CALL FOR PAPERS SPECIAL SESSIONS SUBMISSION REGISTRATION CALL FOR EXHIBITION TRAVEL/VENUE ABOUT HangZhou CONCURRENT COURSES PAST CONFERENCES
2026 International Workshop
on Advanced Interconnects
November 4 – 6. 2026
HangZhou, China
WAI HISTORY

Past Conferences

Explore previous editions of the Workshop on Advances in Electromagnetic Compatibility (WAI) and learn about their award-winning research.

2025

WAI 2025

Visit the official website of WAI 2025 for conference information, technical programs, and other materials.

Visit WAI 2025 Website
RESEARCH EXCELLENCE

Awards and Award Winners

Recognizing outstanding contributions to electromagnetic compatibility research and engineering.

2025

WAI 2025 Award Winners

Best Paper Award

  1. Yongjie Chen, Zhou Jin, Cheng Zhuo A Hierarchical Optimization and Learning Framework for Broadband MLCC Equivalent Circuit Modeling
  2. Guangxiao Luo, Yizhe Zhang, Yuhang He Calibration of Simple Transient Electric Field Probe and Circuit-Based Waveform Reconstruction
  3. Hyunwoo Kim, Seunghun Ryu, Sanguk Lee, Seonghi Lee, Dongryul Park, Jinwook Lee, and Seungyoung Ahn Design and Analysis of Perforated Ground Plane for Mode Conversion Mitigation in High-speed Differential Channel of Die-to-Die Interface

Best Paper Honorable Mention Award

  1. Li Jiang, Ling Zhang, Junjie Ren, Keyi Ding, and Er-Ping Li Physics-Constrained Differential Evolution for Continuous Decoupling Capacitor Placement and Orientation Optimization
  2. Xinhong Xie, Zixian Ma, Haotian Chen, Hangkai Zhang, Gaofeng Cai, Yin Sun, Bo Pu, Nayu Li, Chunyi Song, and Zhiwei Xu An Efficient 2D/3D Mesh-Coupled Electro-Thermal Co-Simulation Method for Large-Scale Integrated Millimeter-Wave Phased Arrays
  3. Keyi Ding, Ling Zhang, Li Jiang, Junjie Ren, and Er-Ping Li Multi-Objective Decap Optimization Based on Non-Dominated Sorting Genetic Algorithm

Outstanding Young Scientist Award

  1. Xiong Chen Xi'an Jiaotong University, China
  2. Da-Wei Wang Hangzhou Dianzi University, China
  3. Xinglin Sun Zhejiang University, China
  4. Jun Wang Xidian University, China
  5. Rong Chen Microsystem Integration Group at the National Laboratory of Integrated Circuits and Microsystems, CETC
2024

WAI 2024 Award Winners

Best Paper Award

  1. Lei Deng, Yinzhu Tang, and Qingfeng Lin A Novel Connector Design for PCIe Gen6s
  2. Jiarui Qiu, Zengyi Sun, Hanzhi Ma, and Er-Ping Li Deep Simple Recurrent Unit Based Neural Equalizer for High-Speed Links
  3. Feilin Zheng, Chao Zheng, Xuebao Li, and Xiang Cui Modeling and Experimental Analysis of the Influence of Bonding Wires Layout on Chip Surge Capability

Additional Awards

Further award categories and recipient information will be added when the official records become available.

More Award Winners to Be Announced

This section is reserved for additional WAI 2024 awards and award recipients.

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