Join Us in Ningbo, China!
2025 International Workshop
on Advanced Interconnects
November 5 – 7. 2025
Ningbo, China
Important Dates
IMPORTANT
TIME
• Full paper submission date:
Sep. 30, 2025
• Abstract submission date:
Sep. 30,2025
• Notification of full paper acceptance:
Oct. 20, 2025
• Notification of abstract acceptance:
Oct. 20,2025
• Final paper submission date:
Oct. 25.2025
Keynote Speakers
Dr. Xiaoning Ye
IEEE Fellow
Senior Principal Engineer at Data Center Group of Intel Corporation
Dr. Qin Liu
Software Engineering Director in Sigrity R&D US Group at Cadence Design Systems
Dr. En-Xiao Liu
Senior Principal Scientist & Deputy Department Director, A*STAR, Singapore Adjunct Associate Professor, National University of Singapore
Stanley Zheng
Director of External Cooperation Committee and Chief of Standards at EDA²
Dr. Qiwei Zhan
Professor, Zhejiang University
Industry Plenary
Qingyuan Ren
Business Vice President of RiVAI
Xiangyang Ma
Kunshan Dloorplf Electronic Technology Co., Ltd
Rong Chen
Head of the Microsystem Integration Group at the National Laboratory of Integrated Circuits and Microsystems,CETC
Jianguo Zhang
Sanechips Technology Co., Ltd.
Kezhou Li
Product Engineering Director, System Design and Analysis Group, Cadence
Yi Chen
ZTE Corporation
Ming Zhou
Simulia CST
Caijun Zhao
Huawei Technologies Co., Ltd.
2025 International Workshop on Advanced Interconnects
(WAI 2025)
2025 International Workshop
on Advanced Interconnects
(WAI 2025)
Organizing Committee
Meeting information
WAI 2025 General Chair

Jun Fan (Fellow, IEEE) received the B.S. and M.S. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively, and the Ph.D. degree in electrical engineering from the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, in 2000.

From 2000 to 2007, he was with NCR Corporation, San Diego, CA, USA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology and became a tenured Professor in 2016. From October 2018 to August 2020, he was the Cynthia Tang Missouri Distinguished Professor in computer engineering. He was the Director of the Missouri S&T EMC Laboratory, and the Director of the National Science Foundation (NSF) Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility (EMC) from 2013 to 2020. He was a Senior Investigator of Missouri S&T Material Research Center. His research interests include hardware design and fundamental research for electromagnetic compatibility (including signal and power integrity) at the levels of integrated circuit, package, PCB and system, and development of specialized design tools and innovative measurement technologies. He was the recipient of the IEEE EMC Society Technical Achievement Award in August 2009 and the Richard R. Stoddart Award for Outstanding Performance in 2022.

Er-Ping Li (Fellow, IEEE) received the Ph.D. degree in electrical engineering from Sheffield Hallam University, Sheffield, U.K., in 1992., He is currently a Changjiang-Qianren Distinguished Professor with the Department of information Science and Electronic Engineering, Zhejiang University, Hangzhou, China, and the Dean of the Joint Institute of Zhejiang University— University of Illinois at Urbana-Champaign, Zhejiang University.

Since 1989, he has been a Research Fellow, a Principal Research Engineer, an Associate Professor, and a Technical Director with the Singapore Research Institute and University, Singapore. He has authored or coauthored more than 500 papers published in the referred international journals and conferences, authored two books published by John-Wiley-IEEE Press and Cambridge University Press. He holds and has filed a number of patents at the U.S. patent office. His research interests include electrical modeling and design of micro/ nanoscale integrated circuits, three-dimensional electronic package integration, and nanoplasmonic technology.

Dr. Li is a Fellow of the Singapore Academy of Engineering and the USA Electromagnetics Academy. He was the recipient of the IEEE EMC Technical Achievement Award, in 2006, Singapore IES Prestigious Engineering Achievement Award, and Changjiang Chair Professorship Award, in 2007, 2015 IEEE Richard Stoddard Award on EMC, 2021 IEEE EMC Laurence G. Cumming Award, and Zhejiang Natural Science 1st Class Award.